关键词 |
光刻胶 |
面向地区 |
规格 |
其它 |
|
结构型式 |
分立式 |
显示方式 |
指针式 |
LR812 系列金属剥离胶主要应用于无
线设备、光电子芯片、MEMS 及半导体封装等
领域，作为微米、亚微米金属剥离工艺中双
层剥离工艺的显影牺牲层，LR812 系列产品
相比较LR603系列产品具有更小的内切深度，
适合于内切深度小于 1µm 的金属剥离工艺。
INTRODUCTION
LR812 series metal lift-off resin mainly
used in IC manufacture such as wireless
devices, optoelectronic chips,MEMS and
semiconductor packaging. As the development
sacrificial layer of the tri-layer lift-off process
in the micron and sub-micron metal lift-off
process , compared with the LR603 series the
LR812 series have smaller under-cut length, suitable for metal lift-off process with
under-cut length smaller than 1µm. 产品性能
金属剥离胶膜厚 0.2-1.0μm；
内切深度控制；
良好的附着力；
良好工艺兼容性；
平坦化性能。
FEATURES
The thickness range of LR812 series ：
0.2-1.5μm;
The under-cut length controllable;
Good adhesion;
Good process compatibility;
Excellent planarization performance. 产品型号 PRODUCT RANGE
Spin Curve Pattern Profiles
Product name LR812-100 LR812-050 LR812-030 LR812-020
